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Your search returned 14 records. Click on the hyperlinks to view further details of Titles.. |
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Magazine Name : Ieee Transactions On Components, Packaging, And Manufacturing Technology Part-B: Advanced Packaging
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Year : 1998 Volume number : 21 Issue: 04 |
Review And Summary Of A Silicon Micromachined Gas Chromatography System
(Article)
Subject:
Ammonia
,
Anodic Biofilm
,
Binary Data
Author:
Edard S.
Rolesar
Rocky R.
Reston
Edward S.
Kolesar
page:
324
-
328
Microfluidic Mems For Semiconductor Processing
(Article)
Subject:
Integrated Fuel Processor
,
Mass Flow Rate
,
Microvia
Author:
Albert K.
Henning
Werner
Weber
Mark
Zdebick
page:
329
-
337
Architecture, Defect Tolerance, Tolerance, And Buffer Design For A New Atm Switch
(Article)
Subject:
Asynchronous
,
3-D Vlsi
,
Yield
Author:
V. K
Jain
L
Lin
Susumu
Horiguchi
page:
338
-
345
Programmable Neural Logic
(Article)
Subject:
Floating
,
Hot Electron
,
Threshold Logic Design
Author:
Vasken
Bohossian
Jehoshua
Bruck
page:
346
-
351
Possibilities And Limitations Of Testing In Submicron Cmos
(Article)
Subject:
Cmos Scaling Trends
,
Quiescent Current
,
Leakage Power
Author:
Joan
Figueras
A
Ferreira
page:
352
-
359
Economics Modeling Of Multichip Modules Testing Stretegies
(Article)
Subject:
Cost Modeling
,
Multichip Module
,
Multicarrier System
Author:
Magdy
Abadir
page:
360
-
370
Solder-Jetted Eutectic Pbsn Bumps For Flip-Chip
(Article)
Subject:
Bumps
,
Electroless
,
Flip-Chip
,
Solder-Joint Inspection
Author:
Antal F. J.
Baggerman
Daniel
Schwarzbach
page:
371
-
381
Polymeric Conductive Pastes As Solder Replacement For Flip-Chip Attachment
(Article)
Subject:
Flip-Chip
,
Polymeric Coatings
,
Thermo Optic
Author:
Kaoru U.
Maner
Simon S.
Ang
Leonard W/.
Schaper
page:
382
-
393
Interface Reaction Between Ag-Pd Conductor And Pd-Sn Solder
(Article)
Subject:
Aging
,
Intermetallic
,
Soldering Error
Author:
Yoichi
Moriya
Ryuji
Shinya
page:
394
-
397
Aging Effects On Shear Fatigue Life And Shear Strength Of Soldered Thick Film Joints
(Article)
Subject:
Intermetallic
,
Reliability
,
Shear
Author:
Y. C.
Chan
G. Y.
Li
page:
398
-
406
Numerical Stress Analysis Of Resin Cracking In Lsi Plastic Packages Under Temperature Cyclic Loading Part Iii Material Properties And Package Geometries
(Article)
Subject:
Die Bond
,
Encapsulant
,
Temperature
Author:
Takehisa
Saitoh
M
Toya
Y
Matsuyama
page:
407
-
412
Effective Material Properties And Themal Stress Analysis Of Epoxy Molding Compound In Electronic Packaging
(Article)
Subject:
Coefficient Of Thermal Expansion (Cte)
,
Effective Medium Theory
,
Thermal Stresses
Author:
Dong-Kwang
Shin
Jung-Ju
Lee
page:
413
-
421
Linear Fracture Mechanics Analysis On Growth Of Interfacial Delamination In Lsi Plastic Packages Under Temperature Cyclic Loading
(Article)
Subject:
Coefficient Of Thermal Expansion (Cte)
,
Delamination
,
Thermal Stress
Author:
Takehiro
Saitoh
Hidehito
Matsuyama
Masayuki
Toya
page:
422
-
427
A Low-Cost Technique For Reducing The Simultaneous Switching Noise In Sub-Board Packaging Congigurations
(Article)
Subject:
Fr4 Epoxy
,
Low-Cost
,
Sub-Base
Author:
Shin'Ichi
Koike
Koichi
Kaizu
page:
428
-
433
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